We have a deep experience in designing the most up-to-date circuits. We are proud to design more than 50 circuits a year, most of which are complex high-speed digital PCBs. The circuits designed by us comply with IPC standards and are cost effective to manufacture. Besides circuit design, we undertake to develop products from the idea to production, providing the background based on engineering, embedded software development and project management. We organise 2/3-day courses on high-speed circuit design.
Designing a circuit diagram means more than just drawing the circuit in the CAD system, it often includes selecting the main components and developing the detailed technical specifications.Very often, contradicting requirements (on price, availability, manufacturability) have to be complied with during the design phase, that is why we focus on continuous consultation with our clients to be able to make optimal decisions.Besides having our own parts library, we prepare unique parts libraries as well.
PCBVN has highly-skilled teams to find right solution for complex design problems, Our teams of designers are qualified engineers with over 10 years of experience, also are experts of design through more tools, PCBVN have designed many types of boards range from the consumer electronics, industrial, medical, military, and telecommunications industries, the design capability runs from small samples to large & complex circuit boards.
IPC class 2 and 3, JEDEC and MIL standards are available.
• Single/double sided
• Multilayer; through via hole, blind/buried via and laser via technologies
• Flexible / flexi-rigid printed circuits
• HDI Designs with micro vias and advanced materials – Via-in-Pad, laser micro vias.
• High speed, multi layer digital PCB designs – Bus routing, differential pairs, matched lengths.
• PCB Designs for space, military, medical and commercial applications
• Extensive RF and analog design experience (printed antennas, guard rings , RF shields…)
• Signal integrity issues to meet your digital design needs (tuned traces, diff pairs…)
• PCB Layer management for signal integrity and impedance control
• DDR, DDR2, DDR3, DDR4, SAS and differential pair routing expertise
• High density SMT designs (BGA, uBGA, PCI, PCIE, CPCI…)
• Blind & Buried via ,Flex PCB designs, flexible rigid board of all types
• Low level analog PCB designs .
• Ultra low EMI designs for MRI applications
• Complete assembly drawings
• In-Circuit Test data generation (ICT)
• Drill, panel and cutout drawings design
• Professional fabrication documents creation
As part of the product design process, we create the proper layer order before starting to wire the PCB. For high-speed signal wires and memory interfaces, we use IBIS simulation to optimise impedances, reflections, cut-offs, crosstalks and timings.For multi-gigabit interfaces, the transfer channel is characterised using IBIS-AMI models and 3D simulation in HyperLynx.We use SPICE simulation to control the correct operation of the analogue stage.
